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S-Curve Measurement Made Easy

Repeatable, accurate, and simple to use, ECD's patented BreadOMETER® is the industry standard for S-curve measurement of baked goods. To discuss how BreadOMETER® can help optimize your process and save you time and money, visit us at Hall 9, Booth F20

E
Electronic Controls Design, Inc. (ECD)
9 / F20

Ensuring the consistent, repeatable quality of yeasted baked goods requires assurance that every dough location has reached its specified temperature (Arrival Time) during the baking process.

 BreadOMETER® simplifies S-Curve management with a patented all-in-one sensor design, allowing a single probe insertion for multi-depth dough measurements.

A minimum of two and a maximum of five dough locations plus an external air/oven zone temperature sensor are combined in one easy-to-use tool that guarantees placement accuracy.

S-Curve Management for the Professional Baker

The patented BreadOMETER®  taps into the power of automatic S-Curve analysis to ensure optimal crumb set, texture and shelf-life consistency. From a balanced oven, consistency of placement of the 5 depth dough channels is repeatable by any user, inserting the probe up to the Stop Plate. The BreadOMETER®  also rises with oven spring, to recognize real-world baking conditions. All 6 channels plug into a M.O.L.E.® EV6 profiler at once.

Working in tandem with this versatile 6-in-1 probe, the BreadOMETER®  Environment in the M.O.L.E.® MAP software automatically calculates Yeast Kill, Starch Gelatinization and Arrival to baking temperature as percentages of bake time for yeasted varieties. With a single probe insertion, training is easy and results are reliably consistent for the 5 insertion depths. Derive optimal bake times and settings, speed new product development, and achieve copy exact production across all lines with the BreadOMETER®.

FEATURES

  •  Air Sensor
  • 2 or 5 Product Sensors
  • Works with industry Standard M.O.L.E.®
  • 3-channel model available for V-M.O.L.E. 2
  • Patented Baking Environment
  • Automatic S-Curve Profile

BENEFITS

• Optimize package weights without overage

• Optimize active ingredients benefits

• Produce consistently  high-quality products– at all locations

• Achieve optimum yield across all work shifts

• Rapidly transfer baking processes between ovens & locations

• Consistently find the slowest to bake areas to optimize yield

• Reduce Energy usage by minimizing bake time

• Optimize output per BTU consumed

• Easy to use, works with industry standard M.O.L.E.® Profilers

• One piece probe, solves multiple thermocouples insertion difficulty

• Removes operator as a measurement variable

• Software saves analysis time with automatic S-Curve reporting

• MAP Automatically locates, detects and identifies start temperature

• Yeast Kill Temperature, Gelatinization, Arrival and End Temperature

SYSTEM INCLUDES:

• BreadOMETER® 6 in 1 Sensor (or 3 in 1)

• M.O.L.E.® MAP Software

• Quick Reference Guide

• Carry Case

Order ECD P/N: E51-2733-00

Your contact person

Mike Hayward

Mike Hayward

Director of Operations EMEA

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